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 STGIPS10K60A
IGBT intelligent power module (IPM) 10 A, 600 V, DBC isolated SDIP-25L molded
Features
10 A, 600 V, 3-phase IGBT inverter bridge including control ICs for gate driving and freewheeling diodes 3.3 V, 5 V, 15 V CMOS/TTL inputs comparators with hysteresis and pull down resistor Internal bootstrap diode Interlocking function 5 k NTC thermistor for temperature control VCE(sat) negative temperature coefficient Short-circuit rugged IGBT Under-voltage lockout DBC fully isolated package Isolation rating of 2500 Vrms/min. SDIP-25L

Applications

3-phase inverters for low power motor drives Home appliances, such as washing machines, refrigerators, air conditioners
Description
The STGIPS10K60A intelligent power module provides a compact, high performance AC motor drive for a simple and rugged design. It mainly targets low power inverters for applications such as home appliances and air conditioners. It combines ST proprietary control ICs with the most advanced short circuit rugged IGBT system technology. Please refer to dedicated technical note TN0107 for mounting instructions. Table 1. Device summary
Marking GIPS10K60A Package SDIP-25L Packaging Tube
Order code STGIPS10K60A
June 2010
Doc ID 15587 Rev 5
1/17
www.st.com 17
Contents
STGIPS10K60A
Contents
1 2 Internal block diagram and pin configuration . . . . . . . . . . . . . . . . . . . . 3 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 2.2 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.1 Control part . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.1.1 NTC thermistor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4
Applications information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.1 Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5 6
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
2/17
Doc ID 15587 Rev 5
STGIPS10K60A
Internal block diagram and pin configuration
1
Figure 1.
Pin 1 in OUTU Vboot U boot
Internal block diagram and pin configuration
Internal block diagram
Pin 25 in P L INU HINU VCC
C1 L VG GND
T1
LIN HIN VCC V boot HVG OUT R1
D1
U T2
R2
D2 NU P T3
OUTV Vboot V boot
LIN V boot HVG OUT R3
D3
GN D L INV HINV
C2
HIN VCC
V
L VG GND R4
T4
D4 NV P
OUTW Vboot W boot T5
LIN HIN VCC C3 L VG GND R6 V boot HVG OUT R5
D5 W T6 D6 NW Pin 17
L INW HINW T1 T2 Pin 16 in
1
2
NTC
Doc ID 15587 Rev 5
3/17
Internal block diagram and pin configuration Table 2.
Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
STGIPS10K60A
Pin description
Symbol OUTU Vboot U LINU HINU VCC OUTV Vboot V GND LINV HINV OUTW Vboot W LINW HINW T1 T2 NW W P NV V P NU U P Description High side reference output for U phase Bootstrap voltage for U phase Low side logic input for U phase High side logic input for U phase Low voltage power supply High side reference output for V phase Bootstrap voltage for V phase Ground Low side logic input for V phase High side logic input for V phase High side reference output for W phase Bootstrap voltage for W phase Low side logic input for W phase High side logic input for W phase NTC thermistor terminal 1 NTC thermistor terminal 2 Negative DC input for W phase W phase output Positive DC input Negative DC input for V phase V phase output Positive DC input Negative DC input for U phase U phase output Positive DC input
Figure 2.
Pin layout (bottom view)
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Doc ID 15587 Rev 5
STGIPS10K60A
Electrical ratings
2
2.1
Electrical ratings
Absolute maximum ratings
Table 3.
Symbol VPN VPN(surge) VCES IC(2) ICP (3) PTOT tscw
Inverter part
Parameter Supply voltage applied between P - NU, NV, NW Supply voltage (surge) applied between P - NU, NV, NW Collector emitter voltage (VIN(1) = 0) Each IGBT continuous collector current at TC = 25C Each IGBT pulsed collector current Each IGBT total dissipation at TC = 25C Short-circuit withstand time, VCE = 0.5 V(BR)CES Tj = 125 C, VCC = Vboot= 15 V, VIN (1)= 5 V Value 450 500 600 10 20 26 5 Unit V V V A A W s
1. Applied between HINi, LINi and GND for i = U, V, W. 2. Calculated according to the iterative formula:
T j ( max ) - T C I C ( T C ) = --------------------------------------------------------------------------------------------------------R thj - c x V CE ( sat ) ( max ) ( T j ( max ), I C ( T C ) )
3. Pulse width limited by max junction temperature.
Table 4.
Symbol VOUT VCC Vboot VIN dVout/dt
Control part
Parameter Output voltage applied between OUTU, OUTV, OUTW - GND (VCC = 15 V) Low voltage power supply Bootstrap voltage applied between Vboot i - OUTi for i = U, V, W Logic input voltage applied between HINi, LINi and GND for i = U, V, W Allowed output slew rate Value -3 to Vboot -18 -0.3 to +18 -1 to 618 -0.3 to VCC+0.3 50 Unit V V V V V/ns
Doc ID 15587 Rev 5
5/17
Electrical ratings
STGIPS10K60A
Table 5.
Symbol VISO Tj
Total system
Parameter Isolation withstand voltage applied between each pin and heatsink plate (AC voltage, t = 60sec.) Operating junction temperature Value 2500 -40 to 125 Unit V C
2.2
Thermal data
Table 6.
Symbol Rthj-c
Thermal data
Parameter Thermal resistance junction-case single IGBT max. Thermal resistance junction-case single diode max. Value 3.8 5.5 Unit C/W C/W
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STGIPS10K60A
Electrical characteristics
3
Electrical characteristics
(Tj = 25C unless otherwise specified). Table 7.
Symbol
Inverter part
Value Parameter Test conditions Min. VCC = Vboot = 15 V, VIN(1)= 5 V, IC = 5 A VCC = Vboot = 15 V, VIN(1)= 5 V, IC = 5 A, Tj = 125 C VCE = 600 V VCC = Vboot = 15 V VIN(1) = 0, IC = 5 A Typ. Max. Unit
-
2.1
2.5 V
VCE(sat)
Collector-emitter saturation voltage
-
1.8
ICES VF
Collector-cut off current (VIN(1)=0) Diode forward voltage
-
100 1.9
A V
Inductive load switching time and energy ton tc(on) toff tc(off) trr Eon Eoff Turn-on time Crossover time (on) Turn-off time Crossover time (off) Reverse recovery time Turn-on switching losses Turn-off switching losses VDD = 300 V, VCC = Vboot = 15 V, VIN(1)= 0 / 5 V, IC = 5 A (see Figure 4) 320 70 430 135 130 65 75 J ns
1. Applied between HINi, LINi and GND for i = U, V, W.
Note:
tON and tOFF include the propagation delay time of the internal drive. tC(ON) and tC(OFF) are the switching time of IGBT itself under the internally given gate driving condition.
Doc ID 15587 Rev 5
7/17
Electrical characteristics Figure 3. Switching time test circuit
STGIPS10K60A
Figure 4.
Switching time definition
8/17
Doc ID 15587 Rev 5
STGIPS10K60A
Electrical characteristics
3.1
Control part
Table 8.
Symbol VCCth1 VCCth2 VCChys Iqccu Iqcc RDS(on)
Low supply voltage
Parameter Under voltage turn on threshold Under voltage turn off threshold Under voltage hystereses Under voltage quiescent supply current Quiescent current Bootstrap driver on resistance VCC < 9 V VCC = 15 V VCC > 12.5 V Test conditions Min. Typ. Max. Unit 9.1 7.9 0.9 0.75 1 125 1.2 1.5 9.6 8.3 10.1 8.8 V V V mA mA
Table 9.
Symbol Vbooth1 Vbooth2 Vboothys Iqboot
Bootstrap supply
Parameter Under voltage turn on threshold Under voltage turn off threshold Under voltage hystereses Quiescent current Test conditions Min. Typ. Max. Unit 8.5 7.2 0.9 250 9.5 8.3 10.5 9.2 V V V A
Table 10.
Symbol Vil Vih Iil Iih
Logic input (1)
Parameter Low level logic input voltage High level logic input voltage Low level logic input current High level logic input current VIN(2) = 0 VIN(1) = 15 V 1.8 -1 20 70 Test conditions Min. Typ. Max. Unit 1.1 V V A A
1. See Figure 8: Dead time and interlocking definition. 2. Applied between HINi, LINi and GND for i = U, V, W
Doc ID 15587 Rev 5
9/17
Electrical characteristics
STGIPS10K60A
3.1.1
NTC thermistor
Table 11.
Symbol
R25 R125
NTC thermistor
Parameter Resistance Resistance B-constant Operating temperature Test conditions TC = 25C TC = 125C TC = 25C -40 Min. Typ. Max. Unit. 5 300 3435 125 k k C
B T
Equation 1: resistance variation vs temperature
1 1B -- - ------------ T 298k
R ( T ) = R 25 e
Figure 5.
Typical NTC resistance vs temperature
10/17
Doc ID 15587 Rev 5
STGIPS10K60A
Electrical characteristics
Figure 6.
IC (RMS) (A) 10
Maximum IC(RMS) current vs. switching frequency (1)
AM03801v1
VPN = 300 V, Modulation index = 0.8 PF = 0.6, TJ = 125 C, f SINE = 60 Hz
Figure 7.
IC (RMS) (A) 6
(1)
Maximum IC(RMS) current vs. fSINE
AM03802v1
VPN = 300 V, modulation index = 0.8, PF = 0.6, TJ = 125 C, TC = 100 C
TC = 80 C
8
5
f SW = 12 kHz
6
TC = 100 C
4
f SW = 16 kHz f SW = 20 kHz
4
3
2 0
4
8
12
16
2 fsw(kHz)
1
10
fSINE(Hz)
1. Simulated curves refer to typical IGBT parameters and maximum Rthj-c.
Figure 8.
Dead time and interlocking definition
LIN
DT
DT
LVG
DT
HVG
AM03794v1
Minimum recommended dead time (DT) between low and high side logic input: 1 s.
Doc ID 15587 Rev 5
Interlocking function
H IN
11/17
Applications information
STGIPS10K60A
4
Figure 9.
Applications information
Typical application circuit
12/17
Doc ID 15587 Rev 5
STGIPS10K60A
Applications information
4.1
Recommendations

To prevent the input signals oscillation, the wiring of each input should be as short as possible. By integrating an application specific type HVIC inside the module, direct coupling to MCU terminals without any opto-coupler is possible. Each capacitor should be located as nearby the pins of IPM as possible. Low inductance shunt resistors should be used for phase leg current sensing. Electrolytic bus capacitors should be mounted as close to the module bus terminals as possible. Additional high frequency ceramic capacitor mounted close to the module pins will further improve performance. Recommended operating conditions
Value Parameter Supply Voltage Conditions Min. VPN VCC VBS tdead fPWM Applied between P-Nu,Nv,Nw 13.5 Typ. 300 15 Max. 400 16 16 1 20 V V V s kHz Unit
Table 12.
Symbol
Control supply voltage Applied between VCC-GND High side bias voltage Blanking time to prevent Arm-short PWM input signal Applied between VBOOTi-OUTi for i=U,V,W For each input signal -40C < Tc < 100C -40C < Tj < 125C
Doc ID 15587 Rev 5
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Package mechanical data
STGIPS10K60A
5
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. Please refer to dedicated technical note TN0107 for mounting instructions. Table 13. SDIP-25L package mechanical data
(mm.) Dim. Min. A A1 A2 A3 B B1 B2 C C1 C2 e e1 e2 e3 F F1 R T 44 0.95 1.2 39 21.6 11.45 24.83 5 6.4 11.1 1.95 3.2 4.3 6.1 0.8 0.3 1.35 0.4 0.55 2.35 3.6 4.7 6.5 1.0 0.5 25.22 Typ. Max. 44.8 1.75 2 39.8 22.4 12.25 25.63 5.8 7.4 12.1 2.75 4 5.1 6.9 1.2 0.7 2.15 0.7
14/17
Doc ID 15587 Rev 5
STGIPS10K60A Figure 10. SDIP-25L package mechanical data
Package mechanical data
8154676_F
Doc ID 15587 Rev 5
15/17
Revision history
STGIPS10K60A
6
Revision history
Table 14.
Date 16-Apr-2009 11-May-2009 17-Jul-2009
Document revision history
Revision 1 2 3 Initial release. Added Figure 6 and Figure 7. Reduced VCE(sat) value on Table 7. Document promoted from preliminary data to datasheet. Inserted Figure 3: Switching time test circuit and Table 12: Recommended operating conditions. Updated Table 5: Total system, Table 6: Thermal data, Table 7: Inverter part, Figure 5: Typical NTC resistance vs temperature, Figure 6: Maximum IC(RMS) current vs. switching frequency, Figure 7: Maximum IC(RMS) current vs. fSINE (1) and Section 5: Package mechanical data. Updated Table 7: Inverter part. Minor text changes to improve readability. Changes
06-Apr-2010
4
15-Jun-2010
5
16/17
Doc ID 15587 Rev 5
STGIPS10K60A
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Doc ID 15587 Rev 5
17/17


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